CMI is currently developing a line of high current, rugged solid state switches. Low to mid voltages (12 to 100 Volts) will be handled with advanced power MOSFETs. Higher voltage (greater than 100 Volts) units will employ IGBTs. At present CMI can provide custom packaged IGBT modules built to your specifications. The industry leader in package design and production, CMI will apply its proprietary material expertise to solve all special packaging requirements.

The key to high performance is in the materials. CMI is the industry leader in packaging technology because of its utilization proprietary composites. All packages are manufactured in-house using the advanced material Compotherm. Compotherm is a nine-layer composite metal that possesses excellent rigidity and unequaled thermal properties. It is ideal for applications involving power electronics. Device substrates combine the Compotherm with layers of Alumina to form a material system that provides electrical isolation with high thermal conductivity and heat spreading. This is achieved without the use of hazardous Beryllium Oxide (BeO). An important feature of the Compotherm is that its Thermal Coefficient of Expansion (TCE) is matched to the materials it mates with such as Alumina or Silicon. The result is a strong die-attach surface with no sacrifice in performance. CMI products are assembled with the latest robotic equipment. Component brazing, die attach, wire bonding, and seam sealing are performed with systems built or modified by CMI’s automation specialists. This guarantees accuracy and high product yields that result in superior performance with very competitive pricing. As with all Hi-Rel operations, CMI maintains a complete Quality Control and Assurance system that tests, inspects, and verifies that all product requirements are successfully achieved.